ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,734, issued on Nov. 25, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Laminated wiring board" was invented by Shota Miki (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated wiring board includes a first wiring board, a plurality of second wiring boards disposed side by side and laminated on the first wiring board, a third wiring board laminated on the plurality of second wiring boards, a first insulating resin layer disposed between the first wiring board and the plurality of second wiring boards, and a second insulating resin layer disposed between the plurality of second wiring boards and the third wir...