ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,755, issued on May 27, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Yasuhiko Kusama (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate having a first bonding surface, an electrostatic chuck having a substrate placement surface on which a substrate is placed and a second bonding surface provided on a side opposite to the substrate placement surface, and configured to attract and hold the substrate, and an adhesive layer configured to bond the first bonding surface of the base plate and the second bonding surface of the electros...