ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,426, issued on May 27, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Laminated wiring board" was invented by Shota Miki (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated wiring board includes a plurality of first wiring boards laminated on one another, a first insulating resin layer disposed between two adjacent first wiring boards among the plurality of first wiring boards, and a second insulating resin layer configured to cover side surfaces of the plurality of first wiring boards."
The patent was filed on June 8, 2023, under Application No. 18/331,594.
*For further information, including images, c...