ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,773, issued on March 11, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board and wiring board manufacturing method" was invented by Toshiaki Aoki (Nagano, Japan) and Toyoaki Sakai (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a base material, a through hole that is formed in the base material, a magnetic member that is embedded in the through hole, and a plating film that covers end faces of the magnetic member exposed from the through hole. The magnetic member includes a conductor wire that is covered by a magnetic body. A wiring board manufacturing method includes forming a th...