US Patent Issued to SHINKO ELECTRIC INDUSTRIES on June 24 for "Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,088, issued on June 24, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure" was invented by Hiroshi Taneda (Nagano, Japan), Noriyoshi Shimizu (Nagano, Japan), Rie Mizutani (Nagano, Japan), Masaya Takizawa (Nagano, Japan) and Yoshiki Akiyama (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an interconnect structure including a plurality of interconnect layers, and a plurality of insulating layers having a photosensitive resin as a main c...