ALEXANDRIA, Va., June 25 -- United States Patent no. 12,340,991, issued on June 24, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Aya Uchiyama (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate, a heat-generating part provided on the base plate via an adhesive layer, and an electrostatic chuck provided on the heat-generating part and configured to adsorb and hold a target object. The heat-generating part includes a first insulating layer having a first surface and a second surface opposite to the first surface, the first surface being in contact with the electrostatic chuck, a heat-gene...