ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,232, issued on July 29, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring substrate" was invented by Koichi Nishimura (Nagano, Japan) and Kazuhiro Kobayashi (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a wiring layer that includes a first pad on which a first recess portion is formed and a second pad on which a second recess portion is formed; an insulating layer that includes a first opening portion penetrating to the first recess portion and a second opening portion penetrating to the second recess portion; a first metal layer filling each of the first opening portion and the ...