ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,922, issued on Jan. 13, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Kensuke Uchida (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first interconnect structure including a first interconnect layer and a first insulating layer, and a second interconnect structure, including a second interconnect layer and a second insulating layer, and disposed on the first interconnect structure. Interconnect width and spacing of the second interconnect layer are smaller than those of the first interconnect layer. The first insulating layer covers a side surface of the fi...