ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,526,921, issued on Jan. 13, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Kyota Yamamura (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first interconnect layer, an insulating layer covering the first interconnect layer, a via interconnect penetrating the insulating layer, and a second interconnect layer provided on an upper surface of the insulating layer and electrically connected to the first interconnect layer through the via interconnect. The via interconnect includes a first seed layer that covers an inner wall surface of a via hole penetrating the insul...