ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,582, issued on Feb. 3, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Masaya Takizawa (Nagano, Japan) and Yuki Kobayashi (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an insulating layer covering upper and side surfaces of a first interconnect layer, a via hole penetrating the insulating layer and reaching the first interconnect layer, a second interconnect layer filling the via hole and extending on the insulating layer, and a cavity provided in the first interconnect layer, communicating with the via hole and extending outside than a lower end of an inner s...