ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,257, issued on Feb. 10, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring substrate" was invented by Toshiki Shirotori (Nagano, Japan), Ryota Hoshina (Nagano, Japan) and Kenta Nakamura (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first wiring layer, an insulation layer covering the first wiring layer, a first through hole extending through the insulation layer and exposing part of the upper surface of the first wiring layer, and a second through hole arranged adjacent to the first through hole. The second through hole extends through the insulation layer in the thickness-wise ...