ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,042, issued on Dec. 23, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Header for semiconductor package" was invented by Katsuya Nakazawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A header for a semiconductor package, includes an eyelet having a first surface, a second surface opposite to the first surface, a side surface, and a through hole penetrating the eyelet from the first surface to the second surface, a lead inserted through the through hole, and a metal base bonded to the second surface of the eyelet. The lead is bent at the second surface of the eyelet and protrudes from the side surface of the ey...