ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,544, issued on Dec. 16, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD (Nagano-Ken, Japan).
"Wiring substrate" was invented by Shuhei Momose (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a wiring layer, a protective insulation layer covering the wiring layer, an opening extending through the protective insulation layer and partially exposing an upper surface of the wiring layer, a first plating layer formed inside the opening on the wiring layer that is exposed in the opening, a gap extending between a side surface of the first plating layer and a wall surface of the opening, and a second plating layer...