ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,897, issued on Aug. 26, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate fixing device" was invented by Masahiro Sunohara (Nagano, Japan) and Riku Nishikawa (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate fixing device includes a base plate, a ceramic plate fixed to the base plate and configured to adsorb a substrate by electrostatic force, and an adhesive layer bonding the base plate and the ceramic plate. The adhesive layer includes a plurality of linear heat transfer bodies arranged adjacent to each other such that a longitudinal direction of each linear heat transfer body is along a stack ...