ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,893, issued on Aug. 26, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Substrate detaching apparatus" was invented by Shinji Nakazawa (Nagano, Japan) and Michio Horiuchi (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate detaching apparatus for detaching a substrate attracted to and held onto an attraction surface of an electrostatic chuck includes a moving unit configured to push and move the substrate in a direction parallel to the attraction surface."
The patent was filed on April 8, 2022, under Application No. 17/658,472.
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