ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,702, issued on Aug. 19, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Takashi Nakajima (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes a first wiring layer including a wiring pattern and a pad, a first insulating layer that covers the first wiring layer and exposes, from an upper surfaces thereof, surfaces of the wiring pattern and the pad of the first wiring layer, a second insulating layer that is formed on the upper surface of the first insulating layer, an opening portion that penetrates through the second insulating layer to the pad of the first wiring l...