ALEXANDRIA, Va., April 2 -- United States Patent no. 12,267,953, issued on April 1, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board" was invented by Yukari Chino (Nagano, Japan) and Hideki Ito (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an insulating layer that is formed by using insulating resin and a wiring layer that is formed on a surface of the insulating layer. The wiring layer includes a first area in which a wire is formed, and a second area that includes a pad to which the wire formed in the first area is connected and that has a smaller wire width than the first area. The insulating layer includes a conductor portion that ...