US Patent Issued to SHINKAWA on Sept. 30 for "Bonding device and adjustment method for bonding head" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,458, issued on Sept. 30, was assigned to SHINKAWA LTD. (Tokyo).

"Bonding device and adjustment method for bonding head" was invented by Alexander Dzhangirov (Tokyo) and Yuichiro Noguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface...