US Patent Issued to SHINKAWA on Sept. 16 for "Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,997, issued on Sept. 16, was assigned to SHINKAWA LTD. (Tokyo).

"Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device" was invented by Hiroaki Yoshino (Tokyo) and Shinsuke Tei (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part...