US Patent Issued to SHINKAWA on May 20 for "Bonding apparatus and method for correcting movement amount of bonding head" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,273, issued on May 20, was assigned to SHINKAWA LTD. (Tokyo).

"Bonding apparatus and method for correcting movement amount of bonding head" was invented by Makoto Takahashi (Tokyo) and Tomonori Nakamura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus and method for correcting movement amount of bonding head are provided. The bonding apparatus performs: mark correction of imaging a reference mark using a position detection camera at every prescribed timing and correcting the amount of movement of a bonding head on the basis of the amount of positional deviation between the position of the imaged reference mark and a referenc...