ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,148, issued on March 25, was assigned to SHINKAWA LTD. (Tokyo).
"Wire bonding apparatus" was invented by Shigeru Hayata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the op...