ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,035, issued on June 24, was assigned to SHINKAWA LTD. (Tokyo).
"Mounting device" was invented by Kohei Seyama (Tokyo) and Tetsuya Utano (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mounting device 1 is equipped with: two direct-acting voice coil motors 38 in which a movable element 38c reciprocatingly moves along an axis A relative to a fixed element 38b; and a collet 34A mounted on an end part side of the movable elements 38c, the collet 34A holding a semiconductor chip 101 by suction. The plurality of voice coil motors 38 are disposed so as to be set away from each other along a direction intersecting the axes A, and in a manner that th...