ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,563, issued on July 29, was assigned to SHINKAWA LTD. (Tokyo).
"Semiconductor device manufacturing method" was invented by Hiroaki Yoshino (Tokyo) and Shinsuke Tei (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The semiconductor device manufacturing method includes a bonding step of bonding a wire to an electrode (35a), a looping wire formation step of looping the wire from the electrode (35a) to a dummy electrode (34) to form a looping wire (50a), a pressing step of pressing a part of the wire, a moving step of moving the pressed part of the wire directly above the electrode, a wire separation step of separating the wire partially from a wir...