US Patent Issued to SHINKAWA on July 29 for "Manufacturing method of semiconductor device and wire bonding apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,653, issued on July 29, was assigned to SHINKAWA LTD. (Tokyo).

"Manufacturing method of semiconductor device and wire bonding apparatus" was invented by Toshihiko Toyama (Tokyo) and Shinsuke Tei (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor device includes: a first step of, after joining a wire to an electrode using a capillary, forming a wire part by moving the capillary to a third target point while feeding out the wire; a second step of forming a bent part by moving the capillary to a fourth target point while feeding out the wire; a third step of processing the bent part into a planned cut part b...