ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,650, issued on July 29, was assigned to SHINKAWA LTD. (Tokyo).

"Manufacturing apparatus and manufacturing method of semiconductor device" was invented by Shigeru Hayata (Tokyo) and Osamu Kakutani (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second...