US Patent Issued to SHINDENGEN ELECTRIC MANUFACTURING on July 1 for "Tip connection portion of terminal member and associated semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,750, issued on July 1, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo).

"Tip connection portion of terminal member and associated semiconductor device" was invented by Soichiro Umeda (Saitama, Japan) and Atsushi Kyutoku (Saitama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A terminal member connected to a connection target portion includes: a bent portion bent toward the connection target portion; and a tip connection portion provided at a tip part of the bent portion, in which the tip connection portion is connected to the connection target portion via a conductive bonding material."

The patent was filed on July 5, 2022,...