ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,378, issued on Oct. 21, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).
"Edge portion measuring apparatus and method for measuring edge portion" was invented by Shigeru Oba (Nishigo-mura, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An edge portion measuring apparatus for measuring shape of an edge portion of a wafer, including, a holding portion that holds the wafer, a rotating means for rotating the wafer, a sensor including a light projecting portion for projecting a laser light from a light source onto the edge portion of the wafer held by the holding portion, and a light receiving detection unit receiving diffuse reflected light th...