ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,440,943, issued on Oct. 14, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).
"Method and apparatus for polishing wafer" was invented by Masaaki Oseki (Nishigo-mura, Japan), Tatsuo Abe (Shirakawa, Japan) and Michito Sato (Nishigo-mura, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for polishing a wafer in order to correct a shape of a polished wafer subjected to polishing, by pressing the wafer to a polishing pad while continuously supplying a composition for polishing containing water to perform correction-polishing, the method including the steps of: measuring the shape of the polished wafer before performing the correction-polishin...