US Patent Issued to SHIN-ETSU HANDOTAI on May 13 for "Method for evaluating semiconductor wafer, method for selecting semiconductor wafer and method for fabricating device" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,553, issued on May 13, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).

"Method for evaluating semiconductor wafer, method for selecting semiconductor wafer and method for fabricating device" was invented by Junya Suzuki (Annaka, Japan) and Masakazu Sato (Nishigo-mura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An evaluation method including steps of: acquiring profile measurement data on an entire surface in a thickness direction of a mirror-polished wafer; identifying a slice-cutting direction by performing first-order or second-order differentiation on diameter-direction profile measurement data on the wafer to acquire differential ...