ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,377,509, issued on Aug. 5, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).
"Manufacturing method for a substrate wafer" was invented by Ryo Taga (Nishigo-mura, Japan) and Yuki Tanaka (Nishigo-mura, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for a substrate wafer, including: a wafer having a first and second main surface; forming a flattening resin layer on second main surface; with the flattening resin layer adsorbed and held as a reference surface, grinding or polishing first main surface as a first processing; removing flattening resin layer from the wafer; with the wafer's first main surface subjected to the first...