US Patent Issued to SHIN-ETSU HANDOTAI on April 8 for "Apparatus for cleaning semiconductor silicon wafer and method for cleaning semiconductor silicon wafer" (Japanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,542, issued on April 8, was assigned to SHIN-ETSU HANDOTAI Co. LTD. (Tokyo).

"Apparatus for cleaning semiconductor silicon wafer and method for cleaning semiconductor silicon wafer" was invented by Kensaku Igarashi (Nishigo-mura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for cleaning a semiconductor silicon wafer including: an ozone water treatment step after polishing in ozone water, a step of performing a first ultrasonic-wave-ozone-water treatment of cleaning at room temperature while immersing in ozone water and applying ultrasonic waves; and a step of performing a second ultrasonic-wave-ozone-water treatment of, after the st...