ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,404,373, issued on Sept. 2, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Thermally conductive silicone composition and thermally conductive silicone sheet" was invented by Junichi Tsukada (Annaka, Japan), Takanori Ito (Annaka, Japan), Akihiro Endo (Annaka, Japan) and Megumi Miyano (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermally conductive silicone composition that can be turned into a lightweight cured product superior in thermal conductivity, and is easily processable due to its low viscosity. The composition contains: (A) an organopolysiloxane having at least two alkenyl groups per each molecule; (B) an o...