ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,485, issued on Oct. 21, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method" was invented by Hitoshi Maruyama (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C).(In the formula, R51 is a C1-9 saturated hydrocarbyl group. R52 is a C10-25 saturated hydrocarbyl group. n1 and n2 are numbers that fulfil 0...