ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,468,225, issued on Nov. 11, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Positive resist composition and pattern forming process" was invented by Jun Hatakeyama (Joetsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A positive resist composition is provided comprising a base polymer end-capped with a group having formula (a)-1, (a)-2 or (a)-3. Because of controlled acid diffusion, a resist film of the composition forms a pattern of good profile with a high resolution and reduced edge roughness or dimensional variation."

The patent was filed on Nov. 14, 2022, under Application No. 17/986,271.

*For further information, including images, ...