US Patent Issued to SHIN-ETSU CHEMICAL on June 3 for "Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer" (Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,637, issued on June 3, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer" was invented by Mitsuo Muto (Takasaki, Japan), Shohei Tagami (Annaka, Japan) and Michihiro Sugo (Takasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the firs...