US Patent Issued to SHIN-ETSU CHEMICAL on June 24 for "Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component" (Japanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,467, issued on June 24, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component" was invented by Hideo Nakagawa (Omihachiman, Japan), Yoshinori Ogawa (Kamakura, Japan), Nobuaki Matsumoto (Takasaki, Japan), Shuhei Ueda (Joetsu, Japan), Keiji Ohori (Saitama, Japan) and Kohei Otake (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stamp head unit including: a stamp component including at least a silicone-based rubber film on a quartz glass substrate; a stamp-component-holding ...