ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,742, issued on July 8, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).
"Material for forming adhesive film, patterning process, and method for forming adhesive film" was invented by Mamoru Watabe (Joetsu, Japan), Yuji Harada (Joetsu, Japan), Takayoshi Nakahara (Joetsu, Japan), Yusuke Biyajima (Joetsu, Japan) and Tsutomu Ogihara (Joetsu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A material for forming an adhesive film used for an adhesive film formed directly under a resist upper layer film, contains: (A) a resin having at least one structural unit containing a fluorine-substituted organic sulfonyl anion structure and having at least o...