US Patent Issued to SHIN-ETSU CHEMICAL on Jan. 27 for "Material for forming adhesive film, patterning process, and method for forming adhesive film" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,737, issued on Jan. 27, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Material for forming adhesive film, patterning process, and method for forming adhesive film" was invented by Daisuke Kori (Joetsu, Japan), Yusuke Kai (Joetsu, Japan), Takayoshi Nakahara (Joetsu, Japan) and Mamoru Watabe (Joetsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A material for forming an adhesive film formed between a silicon-containing middle layer and a resist upper layer film, containing: (A) a resin having structural units shown by formula (1) and formula (2); (B) a thermal acid generator; and (C) an organic solvent, in the component (A), the struct...