US Patent Issued to Shin-Etsu Chemical on April 29 for "Thermally conductive silicone rubber sheet comprising a thermally conductive adhesive layer" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,286,568, issued on April 29, was assigned to Shin-Etsu Chemical Co. Ltd. (Tokyo).

"Thermally conductive silicone rubber sheet comprising a thermally conductive adhesive layer" was invented by Takanori Ito (Annaka, Japan) and Akihiro Endo (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One of the purposes of the present invention is to provide a composite heat-release sheet which is excellent in thermal conductivity and electrical insulation property and, at the same time, has all of sufficient adhesion to an actual machine, low thermal resistance, reworkability, and reliable adhesive strength. Another purpose is to provide a more convenient...