US Patent Issued to SHIN-ETSU CHEMICAL on April 15 for "Stamp component for transferring microstructure" (Japanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. D1,070,796, issued on April 15, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Stamp component for transferring microstructure" was invented by Yoshinori Ogawa (Kamakura, Japan), Kazunori Kondo (Takasaki, Japan), Nobuaki Tomura (Sendai, Japan), Nobuaki Matsumoto (Takasaki, Japan), Akira Sakamoto (Takasaki, Japan) and Taichi Kitagawa (Annaka, Japan).

The patent was filed on July 8, 2022, under Application No. D/845,673.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1070796&OS=D1070796&RS=D1070796

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