US Patent Issued to SHIN-ETSU CHEMICAL, NISSIN CHEMICAL INDUSTRY on July 15 for "Epoxy-modified silicone fine particle, a method for preparing the same, a thermosetting resin composition comprising the fine particles and an encapsulating material" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,029, issued on July 15, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo) and NISSIN CHEMICAL INDUSTRY Co. LTD. (Echizen, Japan).

"Epoxy-modified silicone fine particle, a method for preparing the same, a thermosetting resin composition comprising the fine particles and an encapsulating material" was invented by Yoshinori Inokuchi (Annaka, Japan) and Mio Sakai (Echizen, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin while having softness derived from silicone rubber and have excellent adhesion with the thermosett...