US Patent Issued to SHIBAURA MECHATRONICS on July 8 for "Substrate treatment method and substrate treatment apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,869, issued on July 8, was assigned to SHIBAURA MECHATRONICS Corp. (Kanagawa, Japan).

"Substrate treatment method and substrate treatment apparatus" was invented by Yuji Nagashima (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a substrate treatment method of removing an upper end of a protrusion on a substrate is disclosed. An unevenness is formed on a surface of the substrate. The method can supply a first liquid on the surface of the substrate. The unevenness is formed on the surface. The method can form a protective layer. The protective layer covers the surface of the substrate from the first liquid s...