ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,709, issued on Jan. 20, was assigned to Shibaura Mechatronics Corp. (Yokohama, Japan).
"Substrate processing apparatus" was invented by Takahiro Hamada (Yokohama, Japan) and Osamu Yamazaki (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a substrate processing apparatus includes a rotating table configured to rotate a substrate and a plurality of fixing members configured to fix the substrate on the rotating table by grasping the substrate while abutting an outer periphery of the substrate, wherein each fixing member includes a curved surface on a side that abuts the substrate, a reduced portion formed to ...