ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,120, issued on April 15, was assigned to SHIBAURA MECHATRONICS Corp. (Kanagawa, Japan).
"Substrate treatment device" was invented by Minami Nakamura (Yokohama, Japan) and Kensuke Demura (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment device includes a placement platform rotating a substrate, a cooling part supplying a cooling gas to a space between the placement platform and the substrate, a liquid supplier supplying a liquid to a surface of the substrate opposite to the placement platform side, a detector that is above the surface of the substrate and detects a freezing start of the liquid, and a controller cont...