US Patent Issued to SHIBAURA INSTITUTE OF TECHNOLOGY, MURATA MANUFACTURING on May 13 for "Plated substrate" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,297,542, issued on May 13, was assigned to SHIBAURA INSTITUTE OF TECHNOLOGY (Tokyo) and MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Plated substrate" was invented by Tomoji Ohishi (Hitachi, Japan), Yasushi Yoshida (Nagaokakyo, Japan) and Katsuro Hirayama (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard ...