US Patent Issued to Shenzhen Zhongbao New Material Technology on Nov. 18 for "Manufacturing insulated spherical weld gold wire for integrated circuit double-layer stacked package" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,588, issued on Nov. 18, was assigned to Shenzhen Zhongbao New Material Technology Co. Ltd. (Shenzhen, China).

"Manufacturing insulated spherical weld gold wire for integrated circuit double-layer stacked package" was invented by Yanqiong Li (Shenzhen, China) and Shengwei Li (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention discloses a method for manufacturing an insulated spherical weld gold wire for integrated circuit double-layer stacked package, which relates to the technical field of microelectronic packaging spherical weld gold wires, and specifically comprises the following steps: alloy sheet preparation; al...