ALEXANDRIA, Va., June 12 -- United States Patent no. 12,296,381, issued on May 13, was assigned to SHENZHEN UNIVERSITY (Guangdong, China).
"Die molding apparatus" was invented by Jiang Ma (Guangdong, China) and Jian Yang (Guangdong, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present application relates to the technical field of amorphous alloy molding apparatuses, and more particularly to a die molding apparatus. The die molding apparatus includes: a forming structure, a material loading structure, and a vacuum pumping structure. The forming structure includes a forming furnace body having a heating cavity, a material waiting housing having a transition cavity, a feeding pipe having two ends re...