US Patent Issued to SHENZHEN ROBOTVISIONTECHNOLOGY, on April 8 for "Positioning method, positioning device, and processing method for wafer" (Chinese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,098, issued on April 8, was assigned to SHENZHEN ROBOTVISIONTECHNOLOGY CO.,LTD. (Shenzhen, China).

"Positioning method, positioning device, and processing method for wafer" was invented by Yanchao Hu (Shenzhen, China), Xiangtong Wang (Shenzhen, China), Shuang Mei (Shenzhen, China) and Tingkai Jiang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A positioning method, a positioning device, and a processing method for wafer are provided. The wafer includes a plurality of dies. The positioning method for wafer includes: obtaining a first reference image of the wafer and obtaining a first rotation angle based on the first reference image...