US Patent Issued to Shenzhen Newsonic Technologies on July 8 for "Surface acoustic wave filter wafer-level packaging structure and method" (Chinese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,414, issued on July 8, was assigned to Shenzhen Newsonic Technologies Co. Ltd. (Shenzhen, China).

"Surface acoustic wave filter wafer-level packaging structure and method" was invented by Guojun Weng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fabrication method of a surface acoustic wave (SAW) filter includes obtaining a filter wafer, which includes: obtaining a first substrate; and forming an interdigital transducer (IDT) on the first substrate, the IDT including a first input and output end, a second input and output end, and an interdigital portion. The method further includes: forming a dielectric layer on the filter wafer,...