ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,420, issued on July 8, was assigned to Shenzhen Newsonic Technologies Co. Ltd. (Shenzhen, China).

"Bulk acoustic wave resonator with metal bonding layer" was invented by Guojun Weng (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bulk acoustic wave (BAW) resonator includes: a substrate; a piezoelectric layer disposed above the substrate; a first electrode disposed below the piezoelectric layer and including a first portion and a second portion spaced apart from each other; a second electrode disposed above the piezoelectric layer; a first dielectric layer, a second dielectric layer, and a third dielectric layer sequentially disposed...